胡亂寫寫的東西

Abstract
During conventional wafer level testing of integrated circuits, temporary electrical connections are formed by tungsten needles. There is a desire to replace this technology since it is becoming increasingly difficult to assemble probes with the required geometric tolerances. Furthermore, the forces exerted can damage the device under test. We describe a novel process for the fabrication of non-planar nickel cantilevers. The process is low temperature and independent of the substrate material, which allows the cantilevers to be fabricated on to previously processed wafers. Finally, examples of fabricated devices are discussed.

出平面式的探針優點多多，若是用在測量wafer上，由於是出平面式的，在接觸wafer時探針會較有彈性，而不會去損壞晶圓，此篇是利用稍復雜的製程來達成的；而我們是利用應力來達成的，因此製程較簡單，在此同時也有一篇跟實驗室做的很像的論，但需經過退火過程，而我們的不用，所以，還是我們的探針做的比較好，較有搞頭。


Reference:
Mark Rosamond , David Wood,"Substrate independent fabrication of a non-planar probe card",Microelectronic Engineering 84 (2007) 1207–1210.