胡亂寫寫的東西

Abstract
In the late 90’s and early 2000 an all-optical network was one of the key drivers that fueled the optical telecom market. High port count (64 to 4000) optical-cross-connects (OXC) were the key enabling technology for an all-optical network. In some accounts, more than 50 start-ups were tasked with this technical challenge. OXC had promised to dramatically lower carrier infrastructure costs in the central office, and to enable creation of an all-optical network that would be transparent to transmission speeds. This paper will examine the key packaging challenges in the fabrication of a 1000x1000 OXC, using MOEMS (micro-optical-electromechanical- systems) mirrors in 2N configurations. It will describe how wafer-scale-integration (WSI) allowed for much greater simplification of the overall system and creation of the first fully integrated 3D MOEMS mirrors by Transparent Networks Inc. (TNI). Another key enabling technology for making such high port count OX was the ability to align thousands of optical fibers with their corresponding mirrors. This paper will examine the development challenges and TNI’s solution to this problem.

InvenSense Inc.這家公司所做的面鏡，因為是Steven Nasiri這位作者製作的，所以以他命名為：Nasiri-Platform，而上圖為第二代的設計；有朝一日，我也要發展出以我為名的製程。這篇paper也有發patent，專利號碼為：6,480,230。


Reference:
Steven Nasiri, "Wafer Level Packaging of MOEMS Solves Manufacturability Challenges In Optical Cross Connect",3rd IEEE Photonic Devices and Systems Packaging (PhoPack) Symposium, 2003 IEEE.